Invention Grant
- Patent Title: Test messaging and control circuitry coupled to power pad
- Patent Title (中): 耦合到电源板的测试消息和控制电路
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Application No.: US13941844Application Date: 2013-07-15
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Publication No.: US08972809B2Publication Date: 2015-03-03
- Inventor: Lee D. Whetsel
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; Frederick J. Telecky, Jr.
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/319
Abstract:
The present disclosure describes a novel method and apparatus for using a device's power and ground terminals as a test and/or debug interface for the device. According to the present disclosure, messages are modulated over DC voltages applied to the power terminals of a device to input test/debug messages to the device and output test/debug messages from the device. The present disclosure advantageously allows a device to be tested and/or debugged without the device having any shared or dedicated test or debug interface terminals.
Public/Granted literature
- US20130300443A1 MODULATED TEST MESSAGING FROM DEDICATED TEST CIRCUITRY TO POWER TERMINAL Public/Granted day:2013-11-14
Information query
