Invention Grant
US08972843B2 Sending a subset of component documents of a modular document to an electronic device
有权
将模块化文档的组件文档的子集发送到电子设备
- Patent Title: Sending a subset of component documents of a modular document to an electronic device
- Patent Title (中): 将模块化文档的组件文档的子集发送到电子设备
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Application No.: US12511507Application Date: 2009-07-29
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Publication No.: US08972843B2Publication Date: 2015-03-03
- Inventor: Robert Thomas Owen Rees , Roger Brian Gimson , Helen Balinsky
- Applicant: Robert Thomas Owen Rees , Roger Brian Gimson , Helen Balinsky
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Trop, Pruner & Hu
- Agent Dan Hu
- Main IPC: G06F17/00
- IPC: G06F17/00 ; G06F17/30

Abstract:
To communicate a modular document from a first electronic device to a second electronic device, the first electronic device determines which one or more component documents of the modular document are already available at the second electronic device. The modular document is composed of plural component documents. The first electronic device sends to the second electronic device a subset of the plural component documents of the modular document, where the subset of the plural component documents is other than the one or more component documents already available at the second electronic device.
Public/Granted literature
- US20110029851A1 SENDING A SUBSET OF COMPONENT DOCUMENTS OF A MODULAR DOCUMENT TO AN ELECTRONIC DEVICE Public/Granted day:2011-02-03
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