Invention Grant
- Patent Title: Thermal-aware source code compilation
- Patent Title (中): 热敏感源代码编译
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Application No.: US13711236Application Date: 2012-12-11
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Publication No.: US08972957B2Publication Date: 2015-03-03
- Inventor: Cary L. Bates , Nicholas P. Johnson , Justin K. King
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Biggers Kennedy Lenart Spraggins, LLP
- Main IPC: G06F9/45
- IPC: G06F9/45 ; G06F9/50 ; G06F9/44 ; G06F11/00

Abstract:
Thermal-aware source code compilation including: receiving, by a compiler, an identification of a target computing system, the identification of the target computing system specifying temperature sensors that measure temperature of a memory module; compiling the source code into an executable application including inserting in the executable application computer program instructions for thermal-aware execution, the computer program instructions, when executed on the target computing system, carry out the steps of: retrieving temperature measurements of one or more of the target computing system's temperature sensors; determining, in real-time in dependence upon the temperature measurements, whether a memory module is overheated; if a memory module is overheated, entering a thermal-aware execution state including, for each memory allocation in the executable application, allocating memory on a different memory module than the overheated memory module; and upon the temperature sensors indicating the memory module is no longer overheated, exiting the thermal-aware execution state.
Public/Granted literature
- US20130104110A1 THERMAL-AWARE SOURCE CODE COMPILATION Public/Granted day:2013-04-25
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