Invention Grant
US08973231B1 Methods for forming electrically precise capacitors, and structures formed therefrom
有权
用于形成电精密电容器的方法和由其形成的结构
- Patent Title: Methods for forming electrically precise capacitors, and structures formed therefrom
- Patent Title (中): 用于形成电精密电容器的方法和由其形成的结构
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Application No.: US13868916Application Date: 2013-04-23
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Publication No.: US08973231B1Publication Date: 2015-03-10
- Inventor: Arvind Kamath , Criswell Choi , Patrick Smith , Erik Scher , Jiang Li
- Applicant: Arvind Kamath , Criswell Choi , Patrick Smith , Erik Scher , Jiang Li
- Applicant Address: NO Oslo
- Assignee: Thin Film Electronics ASA
- Current Assignee: Thin Film Electronics ASA
- Current Assignee Address: NO Oslo
- Agency: Central California IP Group, P.C.
- Agent Andrew D. Fortney
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G4/01 ; H01G13/00

Abstract:
High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition are disclosed. The method generally includes the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. The methods provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.
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