Invention Grant
- Patent Title: Manufacturing method of object having conductive line
- Patent Title (中): 具有导线的物体的制造方法
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Application No.: US13244562Application Date: 2011-09-25
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Publication No.: US08973261B2Publication Date: 2015-03-10
- Inventor: Cheng-Hung Chiang
- Applicant: Cheng-Hung Chiang
- Applicant Address: TW Hsinchu County
- Assignee: Getac Technology Corporation
- Current Assignee: Getac Technology Corporation
- Current Assignee Address: TW Hsinchu County
- Priority: CN201010555845 20101115
- Main IPC: H01K3/22
- IPC: H01K3/22 ; H01Q1/38 ; H01K3/20

Abstract:
A manufacturing method of an object having a conductive line includes the following steps. A hardening layer and a conductive line layer are formed in an in-mold roller (IMR) material in sequence. The conductive line layer is formed on a non-conductive substrate by an IMR process. A carrier sheet is then separated to expose the hardening layer. A connecting piece is formed on the hardening layer. The connecting piece runs through the hardening layer by a connection process, and the connecting piece is electrically connected to the conductive line layer. Therefore, an object structure having the conductive line is formed.
Public/Granted literature
- US20120118624A1 MANUFACTURING METHOD OF OBJECT HAVING CONDUCTIVE LINE AND STRUCTURE THEREOF Public/Granted day:2012-05-17
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