Invention Grant
- Patent Title: Floor tile expansion joint
- Patent Title (中): 地板砖膨胀节
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Application No.: US13940468Application Date: 2013-07-12
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Publication No.: US08973328B2Publication Date: 2015-03-10
- Inventor: Frederick W. Masanek, Jr. , David F. MacNeil
- Applicant: MacNeil IP LLC
- Applicant Address: US IL Bolingbrook
- Assignee: MacNeil IP LLC
- Current Assignee: MacNeil IP LLC
- Current Assignee Address: US IL Bolingbrook
- Agency: Perkins IP Law Group LLC
- Agent Jefferson Perkins
- Main IPC: E04F15/14
- IPC: E04F15/14 ; E04F15/02
Abstract:
A floor tile expansion joint accommodates differential thermal expansion or contraction of modular floor tiles used in flooring applications. One or more rows of floor tile expansion joints may be connected to modular floor tiles for various floor tile applications.
Public/Granted literature
- US20150013259A1 FLOOR TILE EXPANSION JOINT Public/Granted day:2015-01-15
Information query
