Invention Grant
- Patent Title: Workpiece for frame gang saw, method for cutting the workpiece, and product cut by the method
- Patent Title (中): 框锯工件,切割工件的方法,切割方法
-
Application No.: US13141471Application Date: 2009-12-23
-
Publication No.: US08973566B2Publication Date: 2015-03-10
- Inventor: Hee-Dong Park , Nam-Kwang Kim
- Applicant: Hee-Dong Park , Nam-Kwang Kim
- Applicant Address: KR Osan, Kyungki-Do
- Assignee: Ehwa Diamond Industrial Co., Ltd.
- Current Assignee: Ehwa Diamond Industrial Co., Ltd.
- Current Assignee Address: KR Osan, Kyungki-Do
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: KR10-2008-0132553 20081223
- International Application: PCT/KR2009/007734 WO 20091223
- International Announcement: WO2010/074513 WO 20100701
- Main IPC: B28D1/06
- IPC: B28D1/06 ; B32B3/30

Abstract:
There is provided a method of cutting or drilling workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.
Public/Granted literature
- US20110253121A1 WORKPIECE FOR FRAME GANG SAW, METHOD FOR CUTTING THE WORKPIECE, AND PRODUCT CUT BY THE METHOD Public/Granted day:2011-10-20
Information query