Invention Grant
- Patent Title: Superconductive heat transfer system
- Patent Title (中): 超导传热系统
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Application No.: US12840251Application Date: 2010-07-20
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Publication No.: US08973650B2Publication Date: 2015-03-10
- Inventor: Harish Chandra Dhingra , Donald Gordon Laing
- Applicant: Harish Chandra Dhingra , Donald Gordon Laing
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Fletcher Yoder, P.C.
- Main IPC: F28F27/00
- IPC: F28F27/00 ; F02C7/047
Abstract:
A system, including a superconductive heat transfer assembly, including, a first superconductive heat transfer pipe, a second superconductive heat transfer pipe, and a superconductive heat transfer contact switch configured to open and close a gap between the first superconductive heat transfer pipe and the second superconductive heat transfer pipe.
Public/Granted literature
- US20120017564A1 SUPERCONDUCTIVE HEAT TRANSFER SYSTEM Public/Granted day:2012-01-26
Information query
