Invention Grant
- Patent Title: Packing element with full mechanical circumferential support
- Patent Title (中): 填充元件具有全机械圆周支撑
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Application No.: US13353104Application Date: 2012-01-18
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Publication No.: US08973667B2Publication Date: 2015-03-10
- Inventor: Marcelle H. Hedrick
- Applicant: Marcelle H. Hedrick
- Applicant Address: US TX Houston
- Assignee: Baker Hughes Incorporated
- Current Assignee: Baker Hughes Incorporated
- Current Assignee Address: US TX Houston
- Agent Shawn Hunter
- Main IPC: E21B33/12
- IPC: E21B33/12 ; E21B33/128

Abstract:
A packer device for forming a fluid seal between an inner tubular member and an outer tubular member. The packer device includes a swage assembly that is expandable from a reduced diameter condition to an expanded diameter condition and a substantially deformable packer element for contacting and forming a fluid seal against a surrounding tubular. The packer element radially surrounds the swage assembly and being moved outwardly into a sealing configuration when the swage assembly is moved to its expanded diameter condition.
Public/Granted literature
- US20130180734A1 Packing Element with Full Mechanical Circumferential Support Public/Granted day:2013-07-18
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