Invention Grant
- Patent Title: Housing for encasing an electronic device
- Patent Title (中): 用于封装电子设备的外壳
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Application No.: US14040351Application Date: 2013-09-27
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Publication No.: US08973753B2Publication Date: 2015-03-10
- Inventor: Gary Rayner
- Applicant: TreeFrog Developments, Inc.
- Applicant Address: US CA San Diego
- Assignee: TreeFrog Developments, Inc.
- Current Assignee: TreeFrog Developments, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Main IPC: B65D85/00
- IPC: B65D85/00 ; B65D6/40 ; G06F1/16 ; H04M1/00 ; H05K5/02 ; H05K5/06 ; A45C13/00

Abstract:
An apparatus and system for housing a device include a housing that is configured such that a device may be fitted within the housing and thereby be protected, such as from shocks and/or liquid. The housing may include top and bottom members that may be removably coupled together so as to form the housing. Each top and bottom member optionally includes front and back surfaces surrounded by a perimeter. The perimeter is defined by proximal and distal ends as well as opposing sides. The top and bottom members may include respective clasping mechanisms that extend along the perimeter of the top and bottom members. The clasping mechanisms are configured for coupling the top and bottom members with one another thereby sealing the housing, for instance, in a shock-proof and/or water tight seal.
Public/Granted literature
- US08783457B2 Housing for encasing an electronic device Public/Granted day:2014-07-22
Information query
IPC分类: