Invention Grant
- Patent Title: RFID tag substrate for metal component
- Patent Title (中): 金属部件用RFID标签基板
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Application No.: US13956938Application Date: 2013-08-01
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Publication No.: US08973833B2Publication Date: 2015-03-10
- Inventor: Takayuki Kikuchi , Ken Sotobayashi , Masayuki Mori
- Applicant: Takayuki Kikuchi , Ken Sotobayashi , Masayuki Mori
- Applicant Address: JP Tokyo
- Assignee: Toyo Seikan Kaisha Ltd.
- Current Assignee: Toyo Seikan Kaisha Ltd.
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka
- Priority: JP2006-045024 20060222; JP2006-063651 20060309; JP2006-063652 20060309; JP2006-349856 20061226
- Main IPC: G06K19/02
- IPC: G06K19/02 ; G06K19/07 ; G06K19/077 ; H01Q1/22 ; H01Q1/38 ; H01Q15/00 ; H01Q15/14

Abstract:
An RFID tag substrate on which an RFID tag that performs wireless communication with a reader/writer is disposed includes a substrate layer, and a functional layer laminated or stacked on the substrate layer. The functional layer includes a plurality of layers laminated together including a high-dielectric-constant layer having a predetermined dielectric constant, and a high-permeability layer having a predetermined permeability. A product of the predetermined dielectric constant and the predetermined permeability is not smaller than 250.
Public/Granted literature
- US20140001270A1 RFID TAG SUBSTRATE FOR METAL COMPONENT Public/Granted day:2014-01-02
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