Invention Grant
- Patent Title: Clamp and electronic device accommodating unit
- Patent Title (中): 夹具和电子设备容纳单元
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Application No.: US12723972Application Date: 2010-03-15
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Publication No.: US08973879B2Publication Date: 2015-03-10
- Inventor: Shinji Kodama , Tomohiko Shimizu
- Applicant: Shinji Kodama , Tomohiko Shimizu
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-106705 20090424
- Main IPC: A47B96/00
- IPC: A47B96/00 ; H02G3/32 ; H02G3/08 ; H02G3/16
Abstract:
A clamp includes a base portion, a clamping portion and an urging member. The base portion is connected to a housing accommodating a device. The clamping portion is provided on a first face of the base portion, and clamps a mating member. The urging portion is provided on a second face of the base portion. The urging portion has elasticity, and urges the device in a case where the base portion is connected to the housing.
Public/Granted literature
- US20100271763A1 CLAMP AND ELECTRONIC DEVICE ACCOMMODATING UNIT Public/Granted day:2010-10-28
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