Invention Grant
US08974591B2 Heat-resistant structural wood adhesive compositions involving pMDI, polyol and aromatic polyols
有权
涉及pMDI,多元醇和芳族多元醇的耐热结构木粘合剂组合物
- Patent Title: Heat-resistant structural wood adhesive compositions involving pMDI, polyol and aromatic polyols
- Patent Title (中): 涉及pMDI,多元醇和芳族多元醇的耐热结构木粘合剂组合物
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Application No.: US13635124Application Date: 2011-03-10
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Publication No.: US08974591B2Publication Date: 2015-03-10
- Inventor: Jinlan Ju , Martin Feng , Xiang-Ming Wang
- Applicant: Jinlan Ju , Martin Feng , Xiang-Ming Wang
- Applicant Address: CA Pointe-Claire
- Assignee: FPInnovations
- Current Assignee: FPInnovations
- Current Assignee Address: CA Pointe-Claire
- Agency: Norton Rose Fulbright Canada LLP
- International Application: PCT/CA2011/000265 WO 20110310
- International Announcement: WO2011/113137 WO 20110922
- Main IPC: C09J175/08
- IPC: C09J175/08

Abstract:
This invention describes an adhesive composition that forms the basis of a heat-resistant, fire resistant, and water resistant polyurethane adhesive suitable for applications in the manufacture of wood products, and the method of making the adhesive. The wood finger-jointed studs produced using an adhesive derived from this invention can meet or exceed the fire rating of a period of 60 minutes according to ASTM E 119 and ASTM D 7374. The heat resistance of the adhesive is a result of incorporating thermally stable aromatic polyol molecules into the polymeric structures of the wood adhesive system, which is composed of the reaction products of a poly(methylene diphenyl diisocyanate), at least one of a polyether polyol and a polyester polyol; and the aromatic polyol that is a hydroxyl phenol in a preferred embodiment. Furthermore, this novel wood adhesive system possesses high water-resistance, making it suitable for the manufacture of highly durable engineered wood products. It is fast moisture-curable at ambient temperatures. It is also formaldehyde-free.
Public/Granted literature
- US20130012656A1 HEAT-RESISTANT STRUCTURAL WOOD ADHESIVE COMPOSITIONS INVOLVING pMDI, POLYOL AND AROMATIC POLYOLS Public/Granted day:2013-01-10
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