Invention Grant
- Patent Title: Self-assembled pattern forming method
- Patent Title (中): 自组装图案形成方法
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Application No.: US13930262Application Date: 2013-06-28
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Publication No.: US08974682B2Publication Date: 2015-03-10
- Inventor: Hiroyuki Hieda , Yoshiyuki Kamata , Naoko Kihara , Akira Kikitsu , Ryosuke Yamamoto
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye, P.C.
- Priority: JP2012-223814 20121009
- Main IPC: B44C1/22
- IPC: B44C1/22 ; G03F7/34

Abstract:
A self-assembled pattern forming method in an embodiment includes: forming a guide pattern on a substrate; forming a layer of a first polymer; filling a first block copolymer; and phase-separating the first block copolymer. The guide pattern includes a first recessed part having a depth T and a diameter D smaller than the depth T, and a second recessed part having a width larger than double of the diameter D. The first block copolymer has the first polymer and a second polymer which are substantially the same in volume fraction. By phase-separating the first block copolymer, a cylinder structure and a lamellar structure are obtained.
Public/Granted literature
- US20140097152A1 SELF-ASSEMBLED PATTERN FORMING METHOD Public/Granted day:2014-04-10
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