Invention Grant
- Patent Title: Composition for polishing and composition for rinsing
- Patent Title (中): 用于抛光的组合物和用于冲洗的组合物
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Application No.: US13824149Application Date: 2011-09-20
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Publication No.: US08974691B2Publication Date: 2015-03-10
- Inventor: Kohsuke Tsuchiya , Shuhei Takahashi
- Applicant: Kohsuke Tsuchiya , Shuhei Takahashi
- Applicant Address: JP Kiyosu-shi
- Assignee: Fujimi Incorporated
- Current Assignee: Fujimi Incorporated
- Current Assignee Address: JP Kiyosu-shi
- Agency: Foley & Lardner LLP
- Priority: JP2010-213382 20100924
- International Application: PCT/JP2011/071364 WO 20110920
- International Announcement: WO2012/039390 WO 20120329
- Main IPC: C09K13/06
- IPC: C09K13/06 ; H01L21/302 ; C09K13/00 ; B24B37/04 ; C09G1/02 ; H01L21/02 ; H01L21/306 ; C09K3/14
Abstract:
A polishing composition for a silicon wafer and a rinsing composition for a silicon wafer according to the present invention contain a nonionic surfactant of a polyoxyethylene adduct. The HLB value of the polyoxyethylene adduct is 8 to 15. The weight-average molecular weight of the polyoxyethylene adduct is 1400 or less. The average number of moles of oxyethylene added in the polyoxyethylene adduct is 13 or less. The content of the polyoxyethylene adduct in each of the polishing composition and the rinsing composition is 0.00001 to 0.1% by mass.
Public/Granted literature
- US20130183826A1 COMPOSITION FOR POLISHING AND COMPOSITION FOR RINSING Public/Granted day:2013-07-18
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