Invention Grant
- Patent Title: Sinterable silver flake adhesive for use in electronics
- Patent Title (中): 用于电子产品的可烧结银片粘合剂
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Application No.: US13799002Application Date: 2013-03-13
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Publication No.: US08974705B2Publication Date: 2015-03-10
- Inventor: Harry Richard Kuder , Juliet Grace Sanchez , Xinpei Cao , Matthias Grossmann
- Applicant: Henkel AG & Co. KGaA , Henkel Corporation
- Applicant Address: DE Duesseldorf DE Duesseldof
- Assignee: Henkel AG & Co. KGaA,Henkel IP & Holding GmbH
- Current Assignee: Henkel AG & Co. KGaA,Henkel IP & Holding GmbH
- Current Assignee Address: DE Duesseldorf DE Duesseldof
- Agent Steven C. Bauman
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01B1/22 ; C09J9/02 ; C09J11/02 ; C08K5/14 ; C08K7/06 ; C08K3/08
Abstract:
A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.
Public/Granted literature
- US20130187102A1 SINTERABLE SILVER FLAKE ADHESIVE FOR USE IN ELECTRONICS Public/Granted day:2013-07-25
Information query
