Invention Grant
- Patent Title: Component and a method of processing a component
- Patent Title (中): 组件和处理组件的方法
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Application No.: US13032821Application Date: 2011-02-23
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Publication No.: US08974865B2Publication Date: 2015-03-10
- Inventor: Dechao Lin , Yan Cui , Srikanth Chandrudu Kottilingam , Ganjiang Feng
- Applicant: Dechao Lin , Yan Cui , Srikanth Chandrudu Kottilingam , Ganjiang Feng
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: McNees Wallace & Nurick LLC
- Main IPC: B32B15/00
- IPC: B32B15/00 ; B23K9/04 ; C23C28/02 ; C22C19/00 ; B23K35/30 ; B23P6/00 ; F01D5/00 ; F01D5/28 ; B23K35/00

Abstract:
A component and a method of processing a component are disclosed. The method includes providing a base metal having a feature, removing the feature to form a processed region, applying a first layer to the processed region, and applying a second layer to the first layer. The base metal, the first layer, and the second layer each have predetermined thermal expansion coefficients, yield strengths, and elongations. The processed component includes the first layer applied to a processed region of the base metal and a second layer applied to the first layer.
Public/Granted literature
- US20120214019A1 COMPONENT AND A METHOD OF PROCESSING A COMPONENT Public/Granted day:2012-08-23
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