Invention Grant
- Patent Title: Metal-ceramic substrate and method for manufacturing such a substrate
- Patent Title (中): 金属陶瓷基板及其制造方法
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Application No.: US13279701Application Date: 2011-10-24
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Publication No.: US08974914B2Publication Date: 2015-03-10
- Inventor: Andreas Meyer , Jürgen Schulz-Harder
- Applicant: Andreas Meyer , Jürgen Schulz-Harder
- Applicant Address: DE Eschenbach
- Assignee: Rogers Germany GmbH
- Current Assignee: Rogers Germany GmbH
- Current Assignee Address: DE Eschenbach
- Agency: Welsh Flaxman & Gitler LLC
- Priority: DE102010049499 20101027
- Main IPC: B32B15/04
- IPC: B32B15/04 ; C04B37/00 ; B82Y30/00 ; C04B35/634 ; C04B37/02 ; H01L23/373
Abstract:
A metal-ceramic substrate for electrical circuits or modules includes at least one first outer metal layer forming one first surface side of the metal-ceramic substrate and at least one second outer metal layer forming one second surface side of the metal-ceramic substrate. The outer metal layers are bonded respectively by two-dimensional bonding with the surface sides of a plate-like substrate body.
Public/Granted literature
- US20120107642A1 Metal-ceramic substrate and method for manufacturing such a substrate Public/Granted day:2012-05-03
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