Invention Grant
- Patent Title: Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig
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Application No.: US13926278Application Date: 2013-06-25
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Publication No.: US08975096B2Publication Date: 2015-03-10
- Inventor: Young Il Kim , Bae Hyung Kim , Jong Keun Song , Seung Heun Lee , Kyung Il Cho , Yong Rae Roh , Won Seok Lee
- Applicant: Samsung Electronics Co., Ltd. , Kyungpook National University Industry-Academic Cooperation Foundation
- Applicant Address: KR Suwon-si KR Daegu
- Assignee: Samsung Electronics Co., Ltd.,Kyungpook National University Industry-Academic Cooperation Foundation
- Current Assignee: Samsung Electronics Co., Ltd.,Kyungpook National University Industry-Academic Cooperation Foundation
- Current Assignee Address: KR Suwon-si KR Daegu
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0068261 20120625
- Main IPC: G01R31/26
- IPC: G01R31/26 ; H01L21/66 ; A61B8/00 ; B06B1/02 ; H01L23/00
Abstract:
A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.
Public/Granted literature
- US20130341303A1 JIG, MANUFACTURING METHOD THEREOF, AND FLIP CHIP BONDING METHOD FOR CHIPS OF ULTRASOUND PROBE USING JIG Public/Granted day:2013-12-26
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