Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14060464Application Date: 2013-10-22
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Publication No.: US08975127B2Publication Date: 2015-03-10
- Inventor: Yusuke Terada , Shigeya Toyokawa , Atsushi Maeda
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Miles & Stockbridge P.C.
- Priority: JP2007-153840 20070611; JP2008-71291 20080319
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234 ; H01L29/06 ; H01L29/78 ; H01L21/762 ; H01L21/768 ; H01L23/532

Abstract:
In an LCD driver, in a high voltage resistant MISFET, end portions of a gate electrode run onto electric field relaxing insulation regions. Wires to become source wires or drain wires are formed on an interlayer insulation film of the first layer over the high voltage resistant MISFET. At this moment, when a distance from an interface between a semiconductor substrate and a gate insulation film to an upper portion of the gate electrode is defined as “a”, and a distance from the upper portion of the gate electrode to an upper portion of the interlayer insulation film on which the wires are formed is defined as “b”, a relation of a>b is established. In such a high voltage resistant MISFET structured in this manner, the wires are arranged so as not to be overlapped planarly with the gate electrode of the high voltage resistant MISFET.
Public/Granted literature
- US20140051219A1 Semiconductor Device and Method of Manufacturing the Same Public/Granted day:2014-02-20
Information query
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