Invention Grant
- Patent Title: Method of making a FinFET device
- Patent Title (中): 制造FinFET器件的方法
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Application No.: US14079313Application Date: 2013-11-13
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Publication No.: US08975129B1Publication Date: 2015-03-10
- Inventor: Ming-Feng Shieh , Hung-Chang Hsieh , Chen-Yu Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/308 ; H01L21/764 ; H01L21/762

Abstract:
A method of fabricating a fin-like field-effect transistor (FinFET) device is disclosed. A plurality of mandrel features are formed on a substrate. First spacers are formed along sidewalls of the mandrel feature and second spacers are along sidewalls of the first spacers. Two back-to-back adjacent second spacers separate by a gap in a first region and merge together in a second region of the substrate. A dielectric feature is formed in the gap and a dielectric mesa is formed in a third region of the substrate. A first subset of the first spacer is removed in a fine cut. Fins and trenches are formed by etching the substrate using the first spacer and the dielectric feature as an etch mask.
Information query
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