Invention Grant
- Patent Title: Trench isolation structures and methods for bipolar junction transistors
- Patent Title (中): 双极结型晶体管的沟槽隔离结构和方法
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Application No.: US13874614Application Date: 2013-05-01
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Publication No.: US08975146B2Publication Date: 2015-03-10
- Inventor: Renata Camillo-Castillo , Marwan H. Khater
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Wood, Herron & Evans LLP
- Agent Anthony J. Canale
- Main IPC: H01L21/331
- IPC: H01L21/331 ; H01L29/06 ; H01L29/66 ; H01L29/732 ; H01L21/8222

Abstract:
Device structures, fabrication methods, and design structures for a bipolar junction transistor. A first isolation region is formed in a substrate to define a lateral boundary for an active device region and an intrinsic base layer is formed on the substrate. The intrinsic base layer has a section overlying the active device region. After the intrinsic base layer is formed, the first isolation region is partially removed adjacent to the active device region to define a trench that is coextensive with the substrate in the active device region and that is coextensive with the first isolation region. The trench is at least partially filled with a dielectric material to define a second isolation region.
Public/Granted literature
- US20140327111A1 TRENCH ISOLATION STRUCTURES AND METHODS FOR BIPOLAR JUNCTION TRANSISTORS Public/Granted day:2014-11-06
Information query
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