Invention Grant
- Patent Title: Interface-free metal gate stack
- Patent Title (中): 无接口的金属栅极堆叠
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Application No.: US13925398Application Date: 2013-06-24
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Publication No.: US08975174B2Publication Date: 2015-03-10
- Inventor: Takashi Ando , Kisik Choi , Matthew W. Copel , Richard A. Haight
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini & Bianco PL
- Agent Thomas Grzesik
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/8238 ; H01L27/092 ; H01L29/51

Abstract:
A gate stack for a transistor is formed by a process including forming a high dielectric constant layer on a semiconductor layer. A metal layer is formed on the high dielectric constant layer. A silicon containing layer is formed over the metal layer. An oxidized layer incidentally forms during the silicon containing layer formation and resides on the metal layer beneath the silicon containing layer. The silicon containing layer is removed. The oxidized layer residing on the metal layer is removed after removing the silicon containing layer.
Public/Granted literature
- US20130277751A1 INTERFACE-FREE METAL GATE STACK Public/Granted day:2013-10-24
Information query
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