Invention Grant
- Patent Title: Gold die bond sheet preform
- Patent Title (中): 金模片粘结片预制件
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Application No.: US14205403Application Date: 2014-03-12
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Publication No.: US08975176B2Publication Date: 2015-03-10
- Inventor: Ramesh Kothandapani
- Applicant: Materion Corporation
- Applicant Address: US OH Mayfield Heights
- Assignee: Materion Corporation
- Current Assignee: Materion Corporation
- Current Assignee Address: US OH Mayfield Heights
- Agency: Fay Sharpe LLP
- Agent Richard M. Klein
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00
Abstract:
The amount of gold required for bonding a semiconductor die to an electronic package is reduced by using a sheet preform tack welded to the package prior to mounting the die. The preform, only slightly larger than a semiconductor die to be attached to the package, is placed in the die bond location and tack welded to the package at two spaced locations.
Public/Granted literature
- US20140264949A1 GOLD DIE BOND SHEET PREFORM Public/Granted day:2014-09-18
Information query
IPC分类:
