Invention Grant
- Patent Title: Moulding compound for mouldings with high weather resistance
- Patent Title (中): 具有高耐候性的模制品成型用组合物
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Application No.: US13241776Application Date: 2011-09-23
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Publication No.: US08975337B2Publication Date: 2015-03-10
- Inventor: Werner Hoess , Michael Wicker , Klaus Schultes , Klaus Albrecht , Martin Mohrmann
- Applicant: Werner Hoess , Michael Wicker , Klaus Schultes , Klaus Albrecht , Martin Mohrmann
- Applicant Address: DE Darmstadt
- Assignee: Evonik Röhm GmbH
- Current Assignee: Evonik Röhm GmbH
- Current Assignee Address: DE Darmstadt
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE102004022540 20040505
- Main IPC: C08L33/04
- IPC: C08L33/04 ; C08L33/12 ; C08L35/06

Abstract:
A molding compound comprises a copolymer (I)a), produced by polymerization of 90-100% by weight methylmethacrylate, styrene and malic acid anhydride, and optionally 0-10% by weight additional monomers which can be copolymerized with methylmethacrylate, a (co)polymer (II)b), produced by polymerization of 80-100% by weight methylmethacrylate and optionally 0-20% by weight additional monomers which can be copolymerized with methylmethacrylate, and has a solution viscosity in chloroform at 25° C. (ISO 1628 Part 6) of 50 to 55 ml/g, as well as c) optional conventional additives, auxiliary agents and/or fillers. The molding compound is characterized in that the copolymer (I) has a solution viscosity in chloroform at 25° C. (ISO 1628 Part) of 55 ml/g or less. Also disclosed are moldings produced by thermoplastic processing of the molding compound and their uses.
Public/Granted literature
- US20120015141A1 MOULDING COMPOUND FOR MOULDINGS WITH HIGH WEATHER RESISTANCE Public/Granted day:2012-01-19
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