This is to provide a polyamide resin which can sufficiently ensure all of a relative viscosity ηr (high degree of polymerization), moldable temperature range estimated from a temperature difference (Td−Tm), heat resistance estimated from a melting point Tm, melt moldability estimated from a temperature difference (Tm−Tc), and low water absorbability as compared with the conventional polyoxamide resin.This is a polyamide resin comprising a dicarboxylic acid-derived unit and a diamine-derived unit being bonded, wherein the above-mentioned dicarboxylic acid contains oxalic acid (Compound A), and the above-mentioned diamine contains 1,6-hexanediamine (Compound B) and 2-methyl-1,5-pentanediamine (Compound C).