Invention Grant
- Patent Title: Embedded optical element package module using a thermocouple
- Patent Title (中): 嵌入式光学元件封装模块采用热电偶
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Application No.: US13703880Application Date: 2011-06-14
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Publication No.: US08975504B2Publication Date: 2015-03-10
- Inventor: Dong Han Yoon
- Applicant: Dong Han Yoon
- Agency: Park & Associates IP Law, P.C.
- Priority: KR10-2010-0056176 20100614
- International Application: PCT/KR2011/004327 WO 20110614
- International Announcement: WO2011/159077 WO 20111222
- Main IPC: H01L35/30
- IPC: H01L35/30 ; H01L35/32 ; H01L35/20 ; H01L25/075 ; H01L33/64

Abstract:
An embedded optical element package module uses a thermocouple, which increases the optical output efficiency of an optical element, dissipates high-temperature heat generated by the optical element having high output to prevent degradation, converts waste heat into electrical energy, and supplies the electrical energy as a power source for the optical element to reutilize resources, thereby reducing the amount of power consumed by the optical element and minimizing costs.
Public/Granted literature
- US20130081666A1 EMBEDDED OPTICAL ELEMENT PACKAGE MODULE USING A THERMOCOUPLE Public/Granted day:2013-04-04
Information query
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