Invention Grant
- Patent Title: Electronic component package, electronic component, and electronic component package manufacturing method
- Patent Title (中): 电子元件封装，电子元器件及电子元器件封装制造方法
-
Application No.: US13635024Application Date: 2012-03-16
-
Publication No.: US08975517B2Publication Date: 2015-03-10
- Inventor: Naoki Kohda , Hiroki Yoshioka
- Applicant: Naoki Kohda , Hiroki Yoshioka
- Applicant Address: JP Kakogawa-shi
- Assignee: Daishinku Corporation
- Current Assignee: Daishinku Corporation
- Current Assignee Address: JP Kakogawa-shi
- Agency: Mots Law, PLLC
- Agent Marvin A. Motsenbocker
- Priority: JP2011-061329 20110318
- International Application: PCT/JP2012/056873 WO 20120316
- International Announcement: WO2012/128210 WO 20120927
- Main IPC: H01J5/00
- IPC: H01J5/00 ; H01J15/00 ; H01J3/08 ; H05K5/00 ; H05K5/06 ; H03H9/21 ; H01L23/055 ; H01L23/10 ; H05K13/00 ; H03H9/10
Abstract:
An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.
Public/Granted literature
Information query
