Invention Grant
- Patent Title: Adhesive film and flat cable using same
- Patent Title (中): 胶带和扁平电缆使用相同
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Application No.: US13423619Application Date: 2012-03-19
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Publication No.: US08975522B2Publication Date: 2015-03-10
- Inventor: Daisuke Shanai , Tomiya Abe
- Applicant: Daisuke Shanai , Tomiya Abe
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Roberts Mlotkowski Safran & Cole P.C.
- Priority: JP2011-085516 20110407; JP2011-240476 20111101
- Main IPC: H01B7/08
- IPC: H01B7/08 ; C09J177/08 ; H01B7/295

Abstract:
The adhesive film includes an insulating film, an adhesive layer provided over one side of the insulating film, and an anchor coat layer provided between the one side of the insulating film and the adhesive layer. The adhesive layer is a copolymer polyamide resin which is soluble in a solvent at 25 degrees Celsius and has a melting point of 100 degrees Celsius or more and 150 degrees Celsius or less. The anchor coat layer enhances the adhesion between the insulating film and the adhesive layer.
Public/Granted literature
- US20120255761A1 ADHESIVE FILM AND FLAT CABLE USING SAME Public/Granted day:2012-10-11
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