Invention Grant
- Patent Title: Circuit board
- Patent Title (中): 电路板
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Application No.: US13437033Application Date: 2012-04-02
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Publication No.: US08975527B2Publication Date: 2015-03-10
- Inventor: Hidekiyo Takaoka
- Applicant: Hidekiyo Takaoka
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-231425 20091005
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K3/46

Abstract:
A circuit board prevents breakage at a boundary between a rigid region and a flexible region and includes a body including stacked flexible sheets, and rigid regions and a flexible region more flexible than the rigid regions. A circuit is defined by a conductor provided in the body. In the flexible region on a principal surface of the body, grooves are arranged to be in contact with boundaries between the flexible region and the rigid regions and to extend along the boundaries.
Public/Granted literature
- US20120186860A1 CIRCUIT BOARD Public/Granted day:2012-07-26
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