Invention Grant
- Patent Title: Printed circuit board with connecting wires
- Patent Title (中): 带连接线的印刷电路板
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Application No.: US13669472Application Date: 2012-11-06
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Publication No.: US08975530B2Publication Date: 2015-03-10
- Inventor: Hui-Hsuan Chou , Shih-Ming Huang
- Applicant: Hui-Hsuan Chou , Shih-Ming Huang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW100221461U 20111114
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H05K1/02

Abstract:
A printed circuit board (PCB) includes a substrate, a pad, a plurality of connecting wires and a plurality of separating portions. The pad arranged on at least one surface of the substrate. The plurality of connecting wires increase contact area of the pad and a copper foil around the pad to keep the current of the PCB steady when a lot of current flow through the PCB. The plurality of separating portions located on between the pad and the copper foil around the pad to divide the pad and the copper foil to avoid short-circuit when the copper foil is etched.
Public/Granted literature
- US20130118785A1 PRINTED CIRCUIT BOARD WITH CONNECTING WIRES Public/Granted day:2013-05-16
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