Invention Grant
- Patent Title: Lead frame package structure with low electromagnetic interference
- Patent Title (中): 引线框架封装结构具有低电磁干扰
-
Application No.: US13414732Application Date: 2012-03-08
-
Publication No.: US08975539B2Publication Date: 2015-03-10
- Inventor: Yu-Chang Pai
- Applicant: Yu-Chang Pai
- Applicant Address: TW Hsinchu Science Park, Hsin-Chu
- Assignee: NOVATEK Microelectronics Corp.
- Current Assignee: NOVATEK Microelectronics Corp.
- Current Assignee Address: TW Hsinchu Science Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW100146151A 20111214
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A lead frame package structure with low EMI includes at least a die holder each for supporting a die, and at least a lead frame each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal, wherein the height of the lead is lower than the height of the first terminal and the second terminal.
Public/Granted literature
- US20130153284A1 Lead Frame Package Structure with Low Electromagnetic Interference Public/Granted day:2013-06-20
Information query
IPC分类:
