Invention Grant
- Patent Title: Solid-state imaging device and method of manufacturing the same, radiological imaging apparatus and method of manufacturing the same, and method of testing solid-state imaging device
- Patent Title (中): 固态成像装置及其制造方法,放射成像装置及其制造方法以及固态成像装置的测试方法
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Application No.: US13255258Application Date: 2010-03-26
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Publication No.: US08975591B2Publication Date: 2015-03-10
- Inventor: Kazuki Fujita , Ryuji Kyushima , Harumichi Mori
- Applicant: Kazuki Fujita , Ryuji Kyushima , Harumichi Mori
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2009-089261 20090401
- International Application: PCT/JP2010/055417 WO 20100326
- International Announcement: WO2010/113809 WO 20101007
- Main IPC: H04N5/32
- IPC: H04N5/32 ; H04N5/374 ; H04N17/00 ; H01L27/146

Abstract:
A solid-state imaging device according to an embodiment includes a plurality of signal output units. Each of the plurality of signal output units includes an input terminal electrode group including terminal electrodes for inputting a reset signal, a hold signal, a horizontal start signal, and a horizontal clock signal and an output terminal electrode for providing an output signal. The solid-state imaging device further includes common lines that are provided across the plurality of signal output units. A terminal electrode for the reset signal and a terminal electrode for the hold signal are connected to the corresponding common lines through the corresponding switches.
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