Invention Grant
- Patent Title: Integrated circuits with magnetic core inductors and methods of fabrications thereof
- Patent Title (中): 具有磁芯电感器的集成电路及其制造方法
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Application No.: US14219944Application Date: 2014-03-19
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Publication No.: US08975612B2Publication Date: 2015-03-10
- Inventor: Renate Hofmann , Carsten Ahrens , Wolfgang Klein , Alexander Glas
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L49/02 ; H01F27/28
Abstract:
In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is formed adjacent a top side of the substrate. First trenches are formed within the substrate adjacent the first inductor coil. The first trenches are filled at least partially with a magnetic fill material. At least a first portion of the substrate underlying the first inductor coil is thinned. A backside magnetic layer is formed under the first portion of the substrate. The backside magnetic layer and the magnetic fill material form at least a part of a magnetic core region of the first inductor coil.
Public/Granted literature
- US20140203399A1 Integrated Circuits with Magnetic Core Inductors and Methods of Fabrications Thereof Public/Granted day:2014-07-24
Information query
IPC分类:
