Invention Grant
- Patent Title: Flexible semiconductor device
- Patent Title (中): 柔性半导体器件
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Application No.: US12863202Application Date: 2009-11-13
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Publication No.: US08975626B2Publication Date: 2015-03-10
- Inventor: Takeshi Suzuki , Kenichi Hotehama , Koichi Hirano , Seiichi Nakatani
- Applicant: Takeshi Suzuki , Kenichi Hotehama , Koichi Hirano , Seiichi Nakatani
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPP2008-294119 20081118
- International Application: PCT/JP2009/006071 WO 20091113
- International Announcement: WO2010/058541 WO 20100527
- Main IPC: H01L33/08
- IPC: H01L33/08 ; H01L29/66 ; H01L29/786

Abstract:
There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprises a metal layer comprising a gate electrode, a source electrode and a drain electrode; a metal oxide film made from a metal which constitutes the metal layer and formed over a surface region of the metal layer; and a semiconductor layer formed above the gate electrode via the metal oxide film. In the flexible semiconductor device, uncovered portions, each of which is not covered with the metal oxide film, are locally formed in the surface region of the metal layer; and also electrical connections are formed between the source electrode and the semiconductor layer and between the drain electrode and the semiconductor layer via the uncovered portions.
Public/Granted literature
- US20110042677A1 FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-02-24
Information query
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