Invention Grant
- Patent Title: Heterojunction semiconductor device and manufacturing method
- Patent Title (中): 异质结半导体器件及其制造方法
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Application No.: US13872391Application Date: 2013-04-29
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Publication No.: US08975640B2Publication Date: 2015-03-10
- Inventor: Wolfgang Werner
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AU Villach
- Assignee: Infineon Techonologies Austria AG
- Current Assignee: Infineon Techonologies Austria AG
- Current Assignee Address: AU Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/778 ; H01L29/20 ; H01L29/66

Abstract:
A heterojunction semiconductor device having a semiconductor body is provided. The semiconductor body includes a first semiconductor region comprising aluminum gallium nitride, a second semiconductor region comprising gallium nitride and forming a heterojunction with the first semiconductor region, an n-type third semiconductor region, a p-type fourth semiconductor region forming a first rectifying junction with the third semiconductor region, and an n-type seventh semiconductor region adjoining the heterojunction formed between the first semiconductor region and the second semiconductor region. The first rectifying junction forms a rectifying junction of a transistor structure which is in ohmic contact with the seventh semiconductor region. Further, a method for producing such a heterojunction semiconductor device is provided.
Public/Granted literature
- US20140319532A1 Heterojunction Semiconductor Device and Manufacturing Method Public/Granted day:2014-10-30
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