Invention Grant
- Patent Title: Package for semiconductor light-emitting device and light-emitting device
- Patent Title (中): 用于半导体发光器件和发光器件的封装
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Application No.: US13665696Application Date: 2012-10-31
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Publication No.: US08975657B2Publication Date: 2015-03-10
- Inventor: Yukinari Haraguchi , Takeshi Otsu , Yutaka Mori , Tadahiro Katsumoto
- Applicant: Mitsubishi Chemical Corporation
- Applicant Address: unknown Chiyoda-ky
- Assignee: Mitsubishi Chemical Corporation
- Current Assignee: Mitsubishi Chemical Corporation
- Current Assignee Address: unknown Chiyoda-ky
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-104490 20100428
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/48 ; H01L23/00

Abstract:
An object of the present invention is to provide a package from which a metal wiring and the like are difficult to be detached even when heat is generated from a semiconductor light-emitting element. This object is achieved with a package for a semiconductor light-emitting device comprising at least a molded resin containing (A) a SiH-containing polyorganosiloxane and (B) a filler, wherein an amount of SiH existing in the molded resin, after a heat treatment thereof at 200° C. for 10 minutes, is 20 to 65 μmol/g.
Public/Granted literature
- US20130056788A1 PACKAGE FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE Public/Granted day:2013-03-07
Information query
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