Invention Grant
- Patent Title: Solid-state imaging device, electronic equipment and manufacturing method of the solid-state imaging device
- Patent Title (中): 固态成像装置,电子设备及固态成像装置的制造方法
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Application No.: US13618765Application Date: 2012-09-14
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Publication No.: US08975667B2Publication Date: 2015-03-10
- Inventor: Akiko Honjo , Shinya Yamakawa
- Applicant: Akiko Honjo , Shinya Yamakawa
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2009-054353 20090309
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L31/113 ; H01L27/146

Abstract:
A solid-state imaging device including, active elements configured to handle the charge captured in a photoreceiving region, an element isolation region configured to isolate regions of the active element, a first impurity region configured to surround the element isolation region, and a second impurity region including an impurity region lower in impurity concentration than the first impurity region, the second impurity region being provided between the first impurity region and active elements.
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