Invention Grant
- Patent Title: Semiconductor device and structure for heat removal
- Patent Title (中): 半导体器件和结构的散热
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Application No.: US13555152Application Date: 2012-07-22
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Publication No.: US08975670B2Publication Date: 2015-03-10
- Inventor: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist
- Applicant: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist
- Applicant Address: US CA San Jose
- Assignee: Monolithic 3D Inc.
- Current Assignee: Monolithic 3D Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L29/80
- IPC: H01L29/80 ; H01L23/552 ; H01L23/48 ; H01L27/06

Abstract:
A semiconductor device, including: a semiconductor substrate with a first layer including first transistors; a shield layer overlaying the first layer; a second layer overlaying the shield layer, the second layer including second transistors; wherein the shield layer is a mostly continuous layer with a plurality of regions for connections between the first transistors and the second transistors, and where the second transistors include monocrystalline regions.
Public/Granted literature
- US20120313227A1 SEMICONDUCTOR DEVICE AND STRUCTURE FOR HEAT REMOVAL Public/Granted day:2012-12-13
Information query
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