Integrated circuit comprising a capacitor with HSG metal electrodes

Invention Grant

US08975682B2 Integrated circuit comprising a capacitor with HSG metal electrodes 有权

Title translation: 集成电路包括具有HSG金属电极的电容器

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Patent Title: Integrated circuit comprising a capacitor with HSG metal electrodes
Patent Title (中): 集成电路包括具有HSG金属电极的电容器
Application No.: US12861256

Application Date: 2010-08-23
Publication No.: US08975682B2

Publication Date: 2015-03-10
Inventor: Aomar Halimaoui , Rebha El Farhane , Benoit Froment
Applicant: Aomar Halimaoui , Rebha El Farhane , Benoit Froment
Applicant Address: FR Crolles
Assignee: STMicroelectronics (Crolles 2) SAS
Current Assignee: STMicroelectronics (Crolles 2) SAS
Current Assignee Address: FR Crolles
Agency: Seed IP Law Group PLLC
Priority: FR0406674 20040618
Main IPC: H01L29/94
IPC: H01L29/94 ; H01L27/108 ; H01L49/02

Integrated circuit comprising a capacitor with HSG metal electrodes

Abstract:

An integrated circuit (IC) includes at least one capacitor with metal electrodes. At least one of the electrodes (10 or 30) is formed from at least surface-silicided hemispherical grain silicon or silicon alloy. A fabrication process for obtaining such a capacitor with silicided metal electrodes is also provided.

Abstract(Chinese):

集成电路（IC）包括至少一个具有金属电极的电容器。至少一个电极（10或30）由至少表面硅化半球形硅或硅合金形成。还提供了用硅化金属电极获得这种电容器的制造工艺。

Public/Granted literature

US20100320567A1 INTEGRATED CIRCUIT COMPRISING A CAPACITOR WITH METAL ELECTRODES AND PROCESS FOR FABRCATING SUCH A CAPACITOR Public/Granted day:2010-12-23

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/86	..只能通过对一个或多个通有待整流，放大、振荡或切换的电流的电极供给电流的变化或施加电位的变化方可进行控制的（H01L29/96优先）
H01L29/92	...有电位跃变势垒或表面势垒的电容器
H01L29/94	....金属—绝缘体—半导体，例如MOS