Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14004583Application Date: 2012-03-12
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Publication No.: US08975707B2Publication Date: 2015-03-10
- Inventor: Masaya Ohtsuka
- Applicant: Masaya Ohtsuka
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Cooper & Dunham LLP
- Priority: JP2011-056008 20110314
- International Application: PCT/JP2012/056795 WO 20120312
- International Announcement: WO2012/124794 WO 20120920
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/72 ; H01L29/739 ; H01L29/10 ; H01L29/78 ; H01L29/06 ; G05F1/575

Abstract:
A region for substrate potential is formed of an n-type well at a position in the direction of a channel length relative to the gate electrode and the position is between drain regions in the direction of a channel width. An n-type of a contact region with a higher concentration of n-type impurity than that of the region is provided in the region. The contact region is arranged away from the drain regions with a distance to obtain a desired breakdown voltage of PN-junction between the region and the drain region.
Public/Granted literature
- US20140002143A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-01-02
Information query
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