Invention Grant
- Patent Title: Acoustic wave device
- Patent Title (中): 声波装置
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Application No.: US13565161Application Date: 2012-08-02
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Publication No.: US08975802B2Publication Date: 2015-03-10
- Inventor: Satoru Matsuda , Takashi Matsuda , Michio Miura
- Applicant: Satoru Matsuda , Takashi Matsuda , Michio Miura
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2011-189984 20110831
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03H9/02
Abstract:
An acoustic wave device includes: a comb-like electrode provided on a piezoelectric substrate; and a first medium that covers the comb-like electrode and has at least a silicon oxide film in which an element is doped, wherein sonic speed in the silicon oxide film in which the element is doped is lower than sonic speed in an undoped silicon oxide film.
Public/Granted literature
- US20130049533A1 ACOUSTIC WAVE DEVICE Public/Granted day:2013-02-28
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