A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component.