Invention Grant
- Patent Title: Impedance matching circuits with multiple configurations
- Patent Title (中): 具有多种配置的阻抗匹配电路
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Application No.: US13231824Application Date: 2011-09-13
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Publication No.: US08975981B2Publication Date: 2015-03-10
- Inventor: Puay Hoe See , Xiangdong Zhang
- Applicant: Puay Hoe See , Xiangdong Zhang
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Ramin Mobarhan
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H03F1/56

Abstract:
Reconfigurable impedance matching circuits with multiple configurations are disclosed. A reconfigurable impedance matching circuit may be implemented with a set of reactive elements (e.g., inductors and/or capacitors) and a set of switches. Different configurations may be obtained with different settings of the switches and may be associated with different impedance tuning curves. This may enable the reconfigurable impedance matching circuit to provide better impedance matching for a load circuit (e.g., an antenna). In an exemplary design, the reconfigurable impedance matching circuit includes at least one variable reactive element configured to tune the impedance of the reconfigurable impedance matching circuit in order to provide better impedance matching. In an exemplary design, the reconfigurable impedance matching circuit may include at least one reconfigurable reactive element, each of which can be connected as a series element or a shunt element.
Public/Granted literature
- US20130063223A1 IMPEDANCE MATCHING CIRCUITS WITH MULTIPLE CONFIGURATIONS Public/Granted day:2013-03-14
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