Invention Grant
- Patent Title: Circuit board structure
- Patent Title (中): 电路板结构
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Application No.: US13753534Application Date: 2013-01-30
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Publication No.: US08976011B2Publication Date: 2015-03-10
- Inventor: Hsiang-Chen Kuo , Tsung-Hsing Tsai
- Applicant: Wistron NeWeb Corporation
- Applicant Address: TW Hsinchu Science Park, Hsinchu
- Assignee: Wistron NeWeb Corporation
- Current Assignee: Wistron NeWeb Corporation
- Current Assignee Address: TW Hsinchu Science Park, Hsinchu
- Agent Winston Hsu; Scott Margo
- Priority: TW101224571U 20121219
- Main IPC: G08B9/00
- IPC: G08B9/00 ; G08B1/08 ; H04H40/90

Abstract:
A circuit board structure for a low noise block down-converter is disclosed. The circuit board structure is used for transmitting a first radio-frequency signal and a second radio-frequency signal across each other, and includes a first substrate and a second substrate. The first substrate includes a first wire for transmitting the first radio-frequency signal, a first grounded wire formed in parallel to a side of the first wire, and a second grounded wire formed in parallel to another side of the first wire. The second substrate is electrically connected to the first substrate, and includes a second wire for transmitting the second radio-frequency signal, a third wire formed on a side of the second wire and a fourth wire formed on another side of the second wire.
Public/Granted literature
- US20140167937A1 Circuit Board Structure Public/Granted day:2014-06-19
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