Invention Grant
- Patent Title: Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof
- Patent Title (中): 具有嵌入其中的低频天线图案的电子设备的情况，其模具及其制造方法
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Application No.: US13103297Application Date: 2011-05-09
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Publication No.: US08976074B2Publication Date: 2015-03-10
- Inventor: Jae Suk Sung , Ha Ryong Hong , Ki Won Chang , Hyun Sam Mun , Dae Kyo Lee , Byung Hwa Lee , Tae Sung Kim , Dae Ki Lim , Yong Shik Na , Duk Woo Lee
- Applicant: Jae Suk Sung , Ha Ryong Hong , Ki Won Chang , Hyun Sam Mun , Dae Kyo Lee , Byung Hwa Lee , Tae Sung Kim , Dae Ki Lim , Yong Shik Na , Duk Woo Lee
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2010-0044186 20100511; KR10-2011-0007347 20110125
- Main IPC: H01Q1/40
- IPC: H01Q1/40 ; H01Q1/24
Abstract:
There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.
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