Invention Grant
US08976283B2 Solid-state imaging device, manufacturing method thereof, and camera with alternately arranged pixel combinations having differing on-chip lenses
有权
固态成像装置及其制造方法以及具有不同片上透镜的交替排列的像素组合的照相机
- Patent Title: Solid-state imaging device, manufacturing method thereof, and camera with alternately arranged pixel combinations having differing on-chip lenses
- Patent Title (中): 固态成像装置及其制造方法以及具有不同片上透镜的交替排列的像素组合的照相机
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Application No.: US14175289Application Date: 2014-02-07
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Publication No.: US08976283B2Publication Date: 2015-03-10
- Inventor: Hiroaki Ishiwata , Sanghoon Ha
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2009-173127 20090724
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H04N5/335 ; H04N5/374 ; H01L27/146 ; H04N5/225
Abstract:
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
Public/Granted literature
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