Invention Grant
US08976291B2 Image sensor module with substrate defining gas pressure relieving hole and camera module using same
有权
图像传感器模块，具有限定气体释放孔的基板和使用相同模块的相机模块
- Patent Title: Image sensor module with substrate defining gas pressure relieving hole and camera module using same
- Patent Title (中): 图像传感器模块，具有限定气体释放孔的基板和使用相同模块的相机模块
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Application No.: US13928902Application Date: 2013-06-27
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Publication No.: US08976291B2Publication Date: 2015-03-10
- Inventor: Shin-Wen Chen
- Applicant: Hon Hai Precision Industry Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW101151300A 20121228
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L21/00
Abstract:
An image sensor module includes a ceramic substrate, an image sensor, and a filter. The ceramic substrate defines a light transmitting hole and a receiving recess communicating with the light transmitting hole. The image sensor is received in the receiving recess. The filter is positioned on the ceramic substrate.
Public/Granted literature
- US20140184902A1 IMAGE SENSOR MODULE WITH SUBSTRATE DEFINING GAS PRESSURE RELIEVING HOLE AND CAMERA MODULE USING SAME Public/Granted day:2014-07-03
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