Invention Grant
- Patent Title: Wafer inspection system
- Patent Title (中): 晶圆检查系统
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Application No.: US14224428Application Date: 2014-03-25
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Publication No.: US08976348B2Publication Date: 2015-03-10
- Inventor: Hwan-seok Jang , Jang-man Ko , Jun-seog Seong , Ho-bong Shin , Kil-su Lee , Chang-hun Lee
- Applicant: Samsung Electronics Co., Ltd
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Ellsworth IP Group, PLLC
- Priority: KR10-2010-0053035 20100604
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N23/225 ; G01N21/95 ; G06T7/00 ; G01N21/956
Abstract:
Wafer inspection method to perform wafer inspection based on photo map information. The wafer inspection method may include: detecting a sample center location on a wafer; compensating the detected sample center location to a compensated center location based on photo map information; and detecting defective dies included in the wafer based on the compensated center location.
Public/Granted literature
- US20140204371A1 METHOD OF INSPECTING WAFER Public/Granted day:2014-07-24
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