Invention Grant
US08976370B2 Measuring apparatus, imprint system, measuring method, and device manufacturing method
有权
测量装置,压印系统,测量方法和装置制造方法
- Patent Title: Measuring apparatus, imprint system, measuring method, and device manufacturing method
- Patent Title (中): 测量装置,压印系统,测量方法和装置制造方法
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Application No.: US14086132Application Date: 2013-11-21
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Publication No.: US08976370B2Publication Date: 2015-03-10
- Inventor: Takahiro Miyakawa , Kazuhiro Sato , Ken Minoda , Hideki Ina
- Applicant: Canon Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc. IP Division
- Priority: JP2012-263515 20121130
- Main IPC: G01B11/28
- IPC: G01B11/28 ; G01B11/06

Abstract:
An measuring apparatus includes: a storage unit configured to store a relationship, regarding an irradiation condition predetermined based on a correlation between a characteristic of each of beams of reflected light obtained from a plurality of patterns different from one another in a thickness of a residual layer in a recessed portion and the thickness of the residual layer of each of the plurality of patterns, between the characteristic of the reflected light from each pattern and the thickness of the residual layer of the pattern; and a processing unit configured to, based on a characteristic of reflected light from a pattern formed on a substrate irradiated with light under the irradiation condition and the relationship stored in the storage unit, obtain a thickness of a residual layer in a recessed portion of the pattern formed on the substrate.
Public/Granted literature
- US20140153003A1 MEASURING APPARATUS, IMPRINT SYSTEM, MEASURING METHOD, AND DEVICE MANUFACTURING METHOD Public/Granted day:2014-06-05
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